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C6D04065E Thermal Characteristics

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aeies
aeies Contributor Level 1
in Discrete Products

Hi,

I am trying to run a thermal simulation of a board using the C6D04065E devices in Cadence's Celsius PowerDC simulator. The only thermal characteristic given in the diode datasheet is the R_JC figure, which is 2.89 C/W. The Cadence simulator has several settings for choosing thermal characteristics, see attached screenshots.

image.png
image.png

Can you provide data on the junction-board thermal resistance (or maybe guesstimate) and clarify if the junction-case number is referenced to the package top or bottom?

// Thanks

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  • Forum_Moderator
    Forum_Moderator Wolfspeed Employee - Contributor Level 5
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    Thank you for your post, it has been approved and we will respond as soon as possible.

  • TBhatia
    TBhatia Wolfspeed Admin - Contributor Level 5
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    Hello aesis,

    Thank you for your questions.

    1. The Rth,j-c from the datasheet is the thermal impedance from the junction to bottom-case of the device.
    2. You can estimate the case to board impedance for the E package using:
      image.png

    Where L is the thickness of the solder, A is the assumed thermal transfer area and k is the thermal conductivity of solder used.

    Assuming a general solder thickness of 0.1mm, the approximate area of the case of E package= 25mm^2 and k for lead-tin solder to be 50 W/m.K: the Rth from case to board is 0.08 K/W.

    The total Rth,j-b (junction to board) = Rth,j-c + 0.08 K/W (approximate)

    You can find more details here:

    Thermal Management of Bottom-Side Cooled Surface Mount Devices and Design Considerations

    Let me know if you have any other questions. Thank you!

  • aeies
    aeies Contributor Level 1
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    Hi TBhatia,

    Thank you for your answer. For modelling completeness, do you have a number for the thermal resistance to the package top?

    // Thanks

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