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[FAQ-SF-1] Introduction to SpeedFit

Urvi_Ahluwalia
Urvi_Ahluwalia Wolfspeed Employee - Contributor Level 2
edited February 2023 in SpeedFit Design Simulator

SpeedFit is an online PLECS-based system-level circuit simulator. It is a powerful tool that assists in topology and device selection in the early stages of the design cycle. This tool can help the user select and compare Wolfspeed’s SiC semiconductor devices in common circuit topologies. It allows you to input realistic system parameters related to the application of your interest and virtually test components to estimate the devices’ losses and junction temperature under steady-state operation.

The SpeedFit user interface consists of seven tabs to guide you towards an end goal of simulated current and voltage waveforms and performance data. This data can be used to quickly quantify the advantage of Wolfspeed devices in the application of interest. This manual walks you through the steps for using this tool. Each section of this user manual describes one of the seven tabs of SpeedFit.

Features of SpeedFit 2.0:

  • It can quickly compare different Wolfspeed SiC devices.
  • It can assist in determining the number of devices required to be paralleled. However, these results are not based on circuit or physics models but switching and conduction loss curves from the device datasheet.
  • SpeedFit estimates semiconductor losses and junction temperature.
  • It can help determine the required heatsink performance, assuming ideal sharing between paralleled devices.
  • It has the capability of gathering inductor or transformer waveforms to simplify magnetic specifications.
  • It helps evaluate different topology options for a given system specification.

Assumptions or Limitations of SpeedFit 2.0:

  • All waveforms are ideal. Ringing and overshoots are not considered.
  • Thermal simulation results are based on switching and conduction loss curves from the datasheets of the devices. They are not based on circuit or physics models.
  • SpeedFit only evaluates the semiconductor losses; it does not calculate the total system efficiency.
  • It assumes the ideal sharing of heatsink between different paralleled devices.
  • It does not predict EMI or other circuit issues.
rolfhorn66

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