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Start a SimulationSiC Bare Die handling procedures
Hello Wolfspeed Team,
What are the safe handling procedures to follow during the SiC MOSFET/Diode Bare dies soldering/assembly process? And where to get the soldering temperature profiles for the dies?
Thanks,
Sridharan
Comments
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Thank you for your post, it has been approved and we will respond as soon as possible.
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Hello Sridharan,
we can support you regarding to handling the dies. Do you have the contact details from your local Wolfspeed team?
Soldering/assembly process depends on which material you use. Not all soldering materials have the same temperature profile. Please get in touch with the machine manufacturer of your solder machine. They are experienced in handling different solder materials and dies.
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Hi DHoffmann,
Yes, the soldering process depends on the material selected, but my question is what temperature the dies need to be soldered on with respect to time. This is something that every datasheet typically have, but I couldn't see on for a 1200V 30A bare die datasheet.
And yes, my team has an NDA signed up with Wolfspeed very recently but I yet to get the contact details of the tech team. But for now we can get this discussion going off this forum.
Thank you,
Sridharan
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Hi Sridharan,
please get in touch with your local Wolfspeed contact. Then we can help you.
Do you know who to contact?
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Hi DHoffmann,
My team is following up with Wolfspeed to get the contact details.
Thanks.
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