Thermal management in SMD components
 
            Hi,
I am planning to use the C3M0065090J. So far, I could not find a reference design that uses any of the SMD series. Hence, I am wondering what is the best technique to cool down these SiC mosfets and what is a realistic power level that they can reach with passive cooling.
Comments
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            Hi Gerasimos - thanks for posting. A member of our technical team is looking into your questions and we will respond shortly. 0
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            Hello Gerasimos, Please see below a brief introduction to calculating junction temperature and thermal impedance breakdown for C3M0065090J with some examples of Thermal Interface Materials for Wolfspeed SMDs. SpeedFit is a good resource to run the topology with your system specifications and using thermal impedances from the attached pdf or ball-parking them based on your thermal management system to estimate the power level you can operate at with a general derating recommendation of 75-80% of Tjmax. 2 reference designs for our SMDs that might also be helpful to you are: 0
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            Hi TBhatia, Thank you very much for the useful comment. I would like to ask if you have any power converter reference designs where the thermal design relies on thermal vias (similar to the application note that you attached), because I am curious about the thermal performance of design with thermal vias. Best regards, Gerasimos 0
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            Hi Gerasimos, Currently, we do not have a power converter reference design using C3M0065090J with thermal vias. The previously linked 3.6kW Bridgeless Totem-pole uses the TOLL package which is also a SMD designed with thermal vias. Another evaluation kit is KIT-CRD-HB12N-J1 which might also be a good reference: We can also review the layout for your design if you would need that! 0
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            Hi, I hope that this answered your question. I will close this discussion for now but if you have a follow up question, please "Start a New Discussion" and we would be glad to support you further. 0

