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The base where the chip is welded inside the module

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Emma
Emma Contributor Level 2
in General

Hello, I am using CAS480M12HM3 at present, but I have some difficulties in using it. I hope to get your help
At present.

I am measuring the static characteristics of the module, but I need to consider the change of junction temperature of the device under a single pulse, and I need to know the relevant information of the base at the welding point of the internal package chip of CAS480M12HM3.What are the material, density, specific heat capacity and volume of the base at the welding point of the internal package chip of CAS480M12HM3, respectively? Or just give me a ballpark figure.
This information is very important to me. looking forward to your reply. Thank you

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  • Forum_Moderator
    Forum_Moderator Wolfspeed Employee - Contributor Level 5
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    Thank you for your post, it has been approved and we will respond as soon as possible.

  • AustinC
    AustinC Wolfspeed Admin - Contributor Level 4
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    Hi Emma,

    Typically the quickest way to answer this question is to utilize the LTspice model for the CAS480M12HM3 to predict the junction temperature under your transient condition. The LTspice model contains the transient thermal impedance data for the module and can predict junction temperature at short pulse lengths. The material properties of the module cannot be shared without an NDA.

    Wolfspeed's LTspice & PLECS Models

    Best Regards,

    Austin C.

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