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Start a SimulationMechanical Restrictions of CAB6R0A23GM4T pressfit package and Module Housing Hole
Hello,
I am going to use the CAB6R0A23GM4T in a 3kV, 150A DC-DC converter project. Our PCB designer has calculated that we need a 3.2mm thick PCB to handle the voltage and current. As per this document (https://assets.wolfspeed.com/uploads/2023/10/Wolfspeed_PRD-02302_Wolfpack_Mounting_Instructions_User_Guide.pdf), the pressfit package has been designed to be used with a 2mm board. With thicker boards, I understand as per the document that detaching the module from the board could be a problem. Are there any other concerns that I need to be aware of? Is there any way to make it work with a 3.2mm board?
Also, I noticed that there is a hole in the housing of the power module (see image below). In the PCB footprint, this is treated as a keepout for traces. This is going to be a bit of a problem because that hole comes between DC- pin that need to be connected internally. I want to know whether there are any problems routing traces directly underneath this hole?
Comments
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Thank you for your post, it has been approved and we will respond as soon as possible.
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The only concern with using a thicker board is sacrificing the ability to press the module out, which may not be a concern depending on your application.
The hole in the housing is for dispensing the dielectric gel during module assembly and may be freely routed over on your PCB. You may also be interested in the design files available for the 2300 V WolfPACK™ GM SiC Modules Evaluation Kit | Wolfspeed as an example.
Please let us know if you have further questions. Thanks!
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Thank you.
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