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danusha
danusha Contributor Level 1
edited February 24 in Module Products

Dear members,

I am reviewing your 60 kW Dual Active Bridge reference design and would like to request clarification regarding the thermal interface material used between the power modules and the heatsink/cold plate.

Could you please provide the following details:

  1. The specific thermal compound (manufacturer and part number)
  2. Thermal Conductivity value
  3. Applied thickness or bond line thickness

Any recommended alternatives or approved equivalent as we are evaluating a similar design and would like to ensure proper thermal performance and reliability.

Thanks

Anusha

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Comments

  • Forum_Moderator
    Forum_Moderator Wolfspeed Employee - Contributor Level 5
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    Thank you for your post, it has been approved and we will respond as soon as possible.

  • ChrisN
    ChrisN Wolfspeed Admin - Contributor Level 4
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    Hello Anusha,

    The CRD60DD12N-GMB uses the CBB011M12GM4T power modules which include pre-applied thermal interface material (PATIM). The "T" at the end of the part number indicates that it includes the PATIM. These PATIM modules use Honeywell PTM6000HV thermal interface material which has a low thermal resistance and stable performance across thermal cycling. The post-cure thickness is typically 190 um for these modules. More information about the PATIM is provided in Section 3 of PRD-07933. From our testing, the Honeywell PTM6000HV is the best thermal interface material for these applications.

    Thanks,

    Chris N.

  • danusha
    danusha Contributor Level 1
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    Thanks for information.

    Anusha

  • ChrisN
    ChrisN Wolfspeed Admin - Contributor Level 4
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    Hello danusha,

    I hope that this answered your question. I will close this discussion for now but if you have a follow up question, please "Start a New Discussion" and we would be glad to support you further.

    Thanks,

    Chris N.

This discussion has been closed.