Top Cooling Mosfet in TO‑263-7 Package

Afzu

Hi Team,

We are currently using the C3M0040120J2-TR (1200 V, 63 A SiC MOSFET in TO‑263‑7LA package) in our design.

 We are looking for an equivalent SiC MOSFET with top-side tab (TO‑263-7) for direct heatsink mounting.

Kindly share suitable part numbers, availability, and datasheets on urgent basis please. matching with above mentioned part spec.

In case TO‑263‑7 package, Top cooling is not available, please suggest part with different package also.

Also suggest the best heat dissipation technique for C3M0040120J2-TR MOSFET.

Forum_Moderator

Thank you for your post, it has been approved and we will respond as soon as possible.

SudharsanC

Hello Sir/Ma’am,

If you are planning to continue with the TO‑263‑7LA package for your current 1200 V discrete SiC MOSFET solution, please note the following options and recommendations:

1.Alternate Package Option
If you are open to alternate packages within the same generation, the TO‑263‑7 package offers a similar footprint, with the primary difference being a smaller drain pad.

2. Recommended Device Alternatives

1. The C4MS series represents our latest technology and is available in the same TO‑263‑7LA package as your existing devices. These parts are readily available in the market.
2. Specifically:C4MS036120J2 (1200 V, 69 A) is a strong alternative to C3M0040120J2‑TR (1200 V, 63 A)

3. Alternative Packaging Solutions (Top-Side Cooling)
For improved thermal performance, you may also consider top-side cooled packages: U2 Package (C3M0040120U2 – 1200 V) .These packages are available across a range of voltage (650 V–1200 V) and current ratings. Please refer to the application note: (PRD-08182 Designing with Wolfspeed Top Side Cooled Packages | Wolfspeed)

4. Thermal Design Guidance

• For optimizing heat dissipation with the C3M0040120J2‑TR, please refer to: PRD-06701: Thermal Management of Bottom-Side Cooled Surface-Mount Devices & Design Considerations (PRD-06701: Thermal Management of Bottom-Side Cooled Surface-Mount Devices & Design Considerations | Wolfspeed)

Thanks,

SudharsanC

Afzu

We are using TO-263-7 LA Package Mosfet. But cooling provision is provided from top side (Plastic body in C3M0040120J2-TR). So kindly suggest, top cooling supporting Mosfet with same package.

Does C4MS036120J2 Mosfet supports Top cooling or cooling pattern is similar to our existing part (C3M0040120J2-TR)? Kindly clarify.

SudharsanC

The C4MS036120J2 is offered in the same package as your existing device (TO‑263‑7LA), ensuring that the cooling approach remains unchanged. It also shares the same PCB footprint, so no layout modifications are required for implementation.

If you are considering a top-side cooling solution, the C3M0040120U2 is a suitable option. However, please note that this package has a different footprint, and design/layout modifications will be required to accommodate it.

Additionally, the TO‑263‑7LA package is inherently designed for bottom-side cooling, and its structure cannot be modified to support top-side cooling. If thermal performance is a concern and top-side cooling is required, we recommend transitioning to a top-side cooled package such as U2 (C3M0040120U2).

Since your current design uses a bottom-side cooled surface-mount device, please follow the thermal management guidelines outlined in: PRD-06701: Thermal Management of Bottom-Side Cooled Surface-Mount Devices & Design Considerations