Setup of thermal cycling testing

MinC

Hi Wolfspeed

Got one question from customer for the setup of thermal cycling testing in qualification & reliability report. is this devices soldered on the PCB or just a bare device only？

The reason for this question is customer is doing one evaluation for the mechanical stress to plastic body during the high/low temperature cycling testing. it will be great if you can provide Coefficient of thermal expansion, material yield strength, Young's modulus and Poisson ratio for our leadframe(footprint).

Thanks.

Mason