Thermal hot spot test of XM3 module and connection reliability between module and driver board

Tangwei

Hi Sir,

Can you provide test guide how to get the hot spot inside the XM3 module by NTC, since threre is temperature gap between NTC and hottest Die.

another question is how to design the connection reliability between driver board and driver board， since vibration test is required and what is vibration level for our XM3 module and CGD12HBXMP driver board, thanks.