Reparability and max PCB thickness of pressfit package (CAB6R0A23GM4T)
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Prathik
Contributor Level 2
Hello,
I am going to use the CAB6R0A23GM4T in a DC-DC converter prototype and I need to a few things.
- How reparable is the pressfit package? If I damage the power module during testing, how easily can I replace it without damaging the pads on the PCB?
- Would it be advisable to make the pads a bit wider so that I can simply solder the pins to the board to improve reparability during testing?
- What is the maximum allowable PCB thickness for this package?
Thanks,
Prathik
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Comments
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Thank you for your post, it has been approved and we will respond as soon as possible.
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Prathik,
- "Products with PCBs that are designed following the above standards may have a WolfPACK™ series module pressed in up to three times. After the third module is removed from the PCB, it is recommended that the PCB be replaced." (PRD-02302: Wolfspeed WolfPACK Mounting Instructions & PCB Requirements, page 7). Please note that modules that have been pressed out should not be pressed in again. I would recommend ensuring your prototype can be reasonably disassembled and reassembled so you can get to the module easily and, should you have to replace a module, I would also check the circuit board for any damage before pressing in another module.
- Larger holes for soldering the pins are ok in initial prototypes, but we don't recommend it for production. If you choose to solder, then use >1.25 mm min hole size to ensure the pins have space to fit. A no-clean flux is recommended to prevent ionic contamination as the module is not hermetically sealed.
- "Note that the press-fit pins are designed to be inserted into a PCB with a maximum thickness of 2 mm. Exceeding the maximum PCB thickness will hinder the ability for the module to be pressed out using the recommended procedure." (PRD-02302: Wolfspeed WolfPACK Mounting Instructions & PCB Requirements, page 6).
Please let us know if you have further questions. Thanks!
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Thank you.
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This discussion has been closed.
