Wolfspeed Power Applications Forum

Wolfspeed Technical Community:

SpeedFit™ Design Simulator

Simulate and evaluate the performance of SiC-based power circuits and determine the right SiC device in seconds.

Start a Simulation

Categories

PCB Footprint recommendation for EDB003M06TM3L

Akshay
Akshay Contributor Level 1
in Module Products

Hello,

We are planning to use EDB003M06TM3L in one of our test designs. As this part has a custom package is it possible to get MFR recommended land pattern for the PCB footprint in this case. Below Altium and ORCAD file available on the website also does not contain files for this package. Can anyone please help with recommended land pattern or Altium Lib file for this part.

All Power OrCad Files (ZIP)

All Power Altium Files (ZIP)

Tagged:

Comments

  • Forum_Moderator
    Forum_Moderator Wolfspeed Employee - Contributor Level 5

    Thank you for your post, it has been approved and we will respond as soon as possible.

  • BrettSparkman
    BrettSparkman Wolfspeed Employee - Contributor Level 2

    Hello Akshay,

    The EDB003M06TM3L (and TM product family in general) are not like traditional discrete TH or SMD parts for general PCB usage.

    Typically, these parts are soldered or sintered to a coldplate for the thermal interface, laser welded to DC link and output bussing for the power interface, and soldered into a control PCB that includes isolated gate drivers.

    The PCB footprint is just 2x though-holes for the Gate (pin 3) and Kelvin-Source (pin 2) connections.

    From the present datasheet, the pitch of these pins is 3.3mm typical, and the pins are a maximum of 1.0mm across and 0.381mm thick.

    Therefore, we could suggest 2x plated holes with 1.27mm finished TH diameter at a pitch of 3.3mm. The Kelvin-Source is pin closer to the Power-Source terminal.

    The annular ring and final specifications could depend on your board house, assembly intent, and standards (such as IPC-2221B).

    Thanks,

    Brett

Sign In or Register to comment.