MOSFET ASSEMBLY AUTOMATION DEVELOPMENT

SAIPRASAD

We are transitioning from manual to automated MOSFET assembly for TO-247 (3L and 4L) products from ON Semiconductor. We require clarification on the following:

Screwing Process: We are applying 1.1 Nm of torque during the screwing process and need to hold the MOSFET in place to prevent tilting against the heatsink. What is the maximum permissible pressure we can apply to the MOSFET body during this step?

Pick and Place: What is the recommended pressure rate for the pick-and-place process, and what is the maximum pressure the MOSFET body can withstand. pls shar the datasheet related to pressure validation report

Forum_Moderator

Thank you for your post, it has been approved and we will respond as soon as possible.

ChadF

Hello SAIPASAD,

Thank you for the question. For the screwing process, we recommend 0.7 Nm with a maximum of 1.0 Nm. The maximum pressure that the MOSFET body can withstand is 150 N/mm^2. Please reach out if you have any more questions in the future. Additional information can be found in the application note linked here, as well as the attached file for your convenience.

Best,

Chad F.

Through Hole Device Mounting and Thermal Measurement_4655.pdf

SAIPRASAD

Hi chad

thanks for the input and the data sheet .