Wolfpack CAB011M12FM3 and CAB016M12FM3 thermal resistance between junction to case

KNJ

I review the datasheets of both CAB011M12FM3 and CAB016M12FM3, the thermal resistance Rth_JH includes thermal resistance of TIM, how about the thermal resistance between junction and case of both modules?

there is another question: how about the isolation voltage and creepage between embedded NTC and MOSFET chips? as temperature sensing analog circuit is under design, it's considered that whether isolation is needed or not in the signal transmission trace?

 Both CAB011M12FM3 and CAB016M12FM3 are selected in 40kW EV charge pile power module project.  

DanMartin

Hi Kenny,

Both of these modules are specified with junction to heatsink thermal resistance. The junction to case thermal resistance is not measured. If there are questions on thermal resistance, thermal models are available for detailed simulation under NDA.

As for isolation, the NTC is isolated from the rest of the power circuit by the isolation rating of the module.

Thanks,

Dan

KNJ

Hi Dan,

thank you for your feedback!  can you test junction to case thermal resistance?

and you mention "isolation rating of the module", is it Visol 3kW in datasheet?

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DanMartin

Hi Kenny,

The isolation voltage is 3 kV as shown in the datasheet. We cannot support an additional measurement of the thermal resistance junction to case at this time.

Thanks,

Dan