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Start a SimulationCAB400M12XM3 thermal resistance
How is the thermal resistance of the CAB400M12XM3 defined? Is it the resistance between the junction and the bottom of the baseplate? Is there a value for the resistance between the junction and the top of the module, either at the power terminals or the case?
Comments
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Hello estalcup,
The thermal resistance for the XM3 power module is defined as the thermal resistance between the virtual junction temperature and the bottom of the baseplate for one switch position.
The virtual junction temperature is the observed junction temperature of a switch position as measured from the outside of the module via a temperature-sensitive electrical parameter (TSEP) such as the forward voltage of the body diode.
We do not provide values for the thermal resistance from the SiC devices to the plastic housing or the power terminals as they are not appreciable thermal paths.
Best Regards,
Austin C.
