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Setup of thermal cycling testing

MinC
MinC Wolfspeed Employee - Contributor Level 2
edited October 2022 in Discrete Products

Hi Wolfspeed

Got one question from customer for the setup of thermal cycling testing in qualification & reliability report. is this devices soldered on the PCB or just a bare device only？

The reason for this question is customer is doing one evaluation for the mechanical stress to plastic body during the high/low temperature cycling testing. it will be great if you can provide Coefficient of thermal expansion, material yield strength, Young's modulus and Poisson ratio for our leadframe(footprint).

Leadframe.png


Thanks.

Mason

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Comments

  • jshao
    jshao Wolfspeed Employee - Contributor Level 2

    Hi Mason,

    We just leave the discrete in a tray & they go through cycling.

    Thanks,

    Jianwen

  • MinC
    MinC Wolfspeed Employee - Contributor Level 2

    Hi Jianwen

    It is clear, thanks a lot for your answer.

  • jshao
    jshao Wolfspeed Employee - Contributor Level 2

    Mason,

    You are welcome. I close this case for now.

    Jianwen

This discussion has been closed.