[FAQ-THERM-1] What are different ways to cool bottom-side cooled surface mount devices?

TBhatia

There are some design considerations when designing the thermal management system of bottom-side cooled SMDs.

For a detailed overview please refer to the Application Note "Thermal Management of Bottom-Side Cooled Surface Mount Devices and Design Considerations" for the choice of device, PCB, Thermal Interface Material (TIM) and heatsink mounting.

For the PCB,

1. Low power (<3-4kW): Thermal vias in PCB can be used. The Application Note linked above discusses the thermal via pattern and PCB details and the impact it has on the thermal impedance of the PCB.
2. High power (>4kW): IMS (insulated Metal substrate) or AlN embedded PCB ) or Aluminum Nitride (AlN) ceramics embedded PCB's are recommended. A good reference for use of AlN embedded PCB's can be found in Wolfspeed KIT-CRD-8FF90P