Reference design of CRD-30DD12N-K: the layer stackup of the main PCB

gkim

Hello,

With respect to the reference design of CRD-30DD12N-K, we are going to build the main board by using the PCB design file of MAIN-0816A.brd.

With respect to the reference layer stackup of the main PCB, I have found out that the prepreg thickneess is 22 mils (0.56mm) and the core thickness is also 22 mils (0.56mm).

Meanwhile our PCB manufacturer employs the prepreg thickness of 0.3mm and the core thickness of 1.1mm.

Would it be fine if the main PCB is manufactured with the the prepreg thickness of 0.3mm and the core thickness of 1.1mm?

Thank you for your consideration.

With regards,

GKIM