Soldering Bare-Die Power MOSFETs

Ayodhya

Currently, I am working with the CPM3-0900-0065A device, which has Al metalized pads for source and gate contacts. I am going to use flip-chip bonding instead of wire bonding. How can I make these pdas solderable? Do you have a variation of the switch that comes with Cu metalized pads?

I really appreciate any help you can provide.

ARomero

Hi Ayodhya,

Like you mentioned, since our "A" metallization has Al pads it cannot be soldered on the topside. We do have some die with a different metallization which are topside solderable but not the 900 V, 65mohm die. Unfortunately, at this time those die can only be shared under NDA. If this is of interest to you please reach out and we can work with you to get the right solution for your application.

Thanks,

Amy

Ayodhya

Hi Amy,

Thank you very much for your reply. Right now, I am not limited to the mentioned rating, and I would like to see the other available options. Could you kindly share whom and how I can reach out regarding this?

Many thanks for considering my request.

Best regards,

Ayodhya

ARomero

Hi Ayodhya, I have sent you an email so that we can discuss this in more detail. Thanks!