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Soldering Bare-Die Power MOSFETs

Ayodhya
Ayodhya Contributor Level 1
edited December 2022 in Bare Die Products

Currently, I am working with the CPM3-0900-0065A device, which has Al metalized pads for source and gate contacts. I am going to use flip-chip bonding instead of wire bonding. How can I make these pdas solderable? Do you have a variation of the switch that comes with Cu metalized pads?


I really appreciate any help you can provide.

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