CRD-22AD12N Reference Design: the datasheets for Item 75 and 76 in the main board BOM

gkim

Hello,

With respect to the reference design of CRD-22AD12N, I have a question on the main board BOM.

In the excel file of Main_board_BOM, the reference designator for Item 75 and 76 is ALN something.

However the exact part name is not available.

Would you please share the datasheets for Item 75 and 76 respectively?

Thank you for your consideration.

With regards,

GKIM

TBhatia

Hello, thank you for your message. A member of our technical team is looking into your questions and we will respond shortly. 

gkim

Hi Carter,

Thank you for sharing the product information for Aluminum Nitride Ceramic substrates.

Meanwhile the PCB substrate size for this reference design is around 186x366(mm).

And two types of AIN ceramic sustrate is used; Substrate 1 has the size of 210x380x1 mm whereas Substrate 2 has the size of 240x380x1 mm.

I suppose that the AIN ceramic substrates are needed for high thermal conductivity and electrical insulation between the SiC MOSFETS and the heat sink block.

Why are both four sheets of Substrate 1 and two sheets of Substrate 2 needed for this reference design?

Thank you for your consideration.

With regards,

GKIM

gkim

Hi Carter,

Thank you for your review.

Would you please upload a figure or photo which shows clearly how six TIMS, SiC MOSFETs and baseplate heatsink are assembled all together?

Thank you for your consideration.

With regards,

GKIM

gkim

Hi Carter,

Thank you for your review.

What would be the picture if the six TIMs are assembled onto this baseplate heatsink?

Thank you for your consideration.

With regards,

GKIM

gkim

Hi Carter,

Thank you for your review.

I have understood the configuration of this prototype product.

Let me close this issue.

I am grateful for your time.

With regards,

GKIM