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Hi
My cusotmer has questions.please cooperate us.
1.Clearance and Creepage Distance
Which pin is the "Terminal" in "Clearance Distance" and "Creepage Distance" of CBB032M12FM3?
2.Thermal resistance
Could you tell me the thermal resistance of the module product and the area of the heat sink?
(The heat sink is assumed to be flat)
"cusotmer would like to know the thermal resistance from the junction to the heat sink surface."
Also, could you please check if there are any calculation models or outline materials for the concept of heat dissipation design for module products?
Best Regard
TKishi
Comments
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Hello, thank you for your message. A member of our technical team is looking into your questions and we will respond shortly.
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Hi TBhatia
Thank you for your reply
If possible, the customer has been informed that they would like to hear from us today.
Can you give me an answer, even if it's only the part that is known?
Regard
TKishi
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Hi TKishi,
"Terminal" refers to any pin (e.g., D+) or set of pins (e.g., G1/S1) that constitutes a voltage node that would require the full high-voltage creepage/clearance distance to another voltage node (e.g., D+ to G1/S1).
The published thermal resistance for baseplate-less WolfPACK modules is a junction to heatsink measurement according to the JESD51-14 standard, as shown below. So for these packages, the TIM layer is included in the published Rth and the heatsink temperature is measured 2mm below the surface of the heatsink. The performance of the heatsink does not impact this measurement.
The best tools to investigate thermal performance will be SpeedFit or downloading our PLECS models to use in standalone.
Thanks,
Jonathan
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Hi Jonathan
Thank you for reply.
Let me just confirm one more thing.
How big is the heatsink for the CBB032M12FM3?
Regard
TKishi
