How to solder SiC bare die directly to a PCB

Sridharan

Hello Wolfspeed team, Good day!!

I am trying to understand how a SiC Mosfet bare die soldered on to a PCB. Is this method recommended for 1200V, 30A rated die? Do you recommend a two side PCB-soldering design approach for effective cooling of the die?

And another question I have is about the creepage distance between the drain and source of the die. From the datasheet I see that it is very narrow (0.1mm). How to ensure functional insulation at 1200V?

Thank you,

Sridharan

(He/His/Him, call me Sri)

Forum_Moderator

Thank you for your post, it has been approved and we will respond as soon as possible.

Sridharan

Update:

After studying the datasheet again, I understood that the drain is on the bottom of the die and the gate- source pads are on the top. So the second part of my earlier post about the creepage distance can be ignored. Thank you.

DHofmann

Dear Sridharan,

thanks for reaching out.

You can solder or sinter a bare die to a PCB. Depending on the solder/sinter material you have to apply a certain temperature/pressure. Pressureless options are available from some solder/sinter material suppliers.

Once the die is attached to the PCB, you need a soft gel or similar encapsulation for the die to guarantee electrical insulation.

Single sided cooling is sufficient and widely used.

TBhatia

Hi, I hope that this answered your question. I will close this discussion for now but if you have a follow up question, please "Start a New Discussion" and we would be glad to support you further.