C2M1000170J Topside Cooling

AbramS16

Hello,

I am working on a project using the C2M1000170J MOSFET with significant power dissipation that may require topside cooling. From the most current data sheets, only junction to case and junction to ambient thermal resistances are listed. Is it possible to top-cool this component? If so what is the associated thermal resistance for top-cooling?

Thank you

Forum_Moderator

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AAnders

Hello,

The TO-263 package is not intended for top-side cooling. Due to the relatively thick layer of plastic mold compound between the die and the top of the package, the amount of heat that can be removed from the top surface is very limited. We have an application note that provides several heatsinking options, as well as specific guidelines and layout techniques for maximizing the thermal performance of this package through the bottom-side of the device through the PCB. For very high power applications, an IMS or ceramic board can further improve heat flow from the drain tab.

https://assets.wolfspeed.com/uploads/2022/10/Wolfspeed_PRD-06701_Thermal_-Management_-Bottomside_-Cooled_-Application_Note.pdf

TBhatia

Hi, I hope that this answered your question. I will close this discussion for now but if you have a follow up question, please "Start a New Discussion" and we would be glad to support you further.