SpeedFit™ Design Simulator
Simulate and evaluate the performance of SiC-based power circuits and determine the right SiC device in seconds.
Start a SimulationDimension info for packaging
Victor
Contributor Level 1
Hello, I am trying to do thermal simulation of a CPM3-1200-0013A embeded package, would you please provide some related info like the footprints and die dimension etc. for my simulation? Thanks. -Victor
Tagged:
0
This discussion has been closed.