Fail to open or Fail to short - short circuit

littlemoon

Hello,

Thanks in advance for any help.

Hope I can find the answer to the question about the short-circuit of SiC module.

It is found in "SiC MOSFET Short Circuit Application Note" as follows:

"This kind of heating is typically adiabatic, and the resulting temperatures can trigger a failure within a
few microseconds." I have a silly question: will the SiC module be left as fail-to-open or fail-to-short?

I guess a burn out may happen, but if the circuit is left short, then it will need more effort to deal with this short circuit situation.

It is said that it may fail to open in the end. I am wondering if there is a general answer, will the SiC will be open finally? And how long the short circuit can last until it burned to open?

"Depending on the currents and bus voltage, the heat generated by a thermal-runaway-induced short-circuit
could be intense enough to burn out the wire bonds and die attach, which could result in the physical
destruction of the discrete package or module. It is worth pointing out that although the chip might fail short,
it is possible that the discrete package or module terminals fail open due to wire-bond burnout as shown in
Figure 19."

Looking forward to hearing any answers. Thanks.