C6D08065Q - Can you connect the N/C pins on the QFN package to a polygon to aid in heat dissipation?

Macker

Hello. I am working on a passive rectifier PCB design using the C6D08065Q SiC diodes and I am wondering if connecting the N/C pins to a polygon would cause issues with the performance of the device. I am thinking that it would be beneficial to connect them to a large copper surface to help with heat dissipation. In addition, would it be safe to assume the same thermal management process as a SiC MOSFET in a similar package (vias to reverse of PCB then heatsink)? Thanks.

Forum_Moderator

Thank you for your post, it has been approved and we will respond as soon as possible.

YuequanHu

Thanks for your interest in our SiC diodes. Regarding your question, there shouldn't be a concern from the device standpoint, but connecting NC pins to a polygon/copper pad will not provide a noticeable improvement to heat dissipation since most of the heat goes directly down from the die into the PCB. Hope this helps.

Macker

Sounds good, that makes sense. Thank you for your help.

YuequanHu

You're welcome! We have an App Note on SM device thermal management. Please take a look. Hope it can be of some help.

Here is the link.

https://assets.wolfspeed.com/uploads/2024/02/Wolfspeed_PRD-06701_Thermal_Management_Bottom-Side_Cooled_Surface-Mount_Devices_Application_Note.pdf