Attaching SiC Multi-Modules (CAB011M12FM3) to the Same Heat Sin

ali1mahmoud

Hello everyone,

I am working with CAB011M12FM3 SiC multi-modules and plan to attach multiple modules to the same heat sink. I want to know if using only thermal paste as the thermal interface material is sufficient or if using a dedicated thermal interface (e.g., thermal pads) between the modules and the heat sink is necessary.

Are there any specific considerations, such as thermal conductivity or electrical isolation, that I should be mindful of when placing these modules on a shared heat sink?

Thanks in advance for your insights!

Forum_Moderator

Thank you for your post, it has been approved and we will respond as soon as possible.

CFlack

ali1mahmoud, 

Wolfspeed’s WolfPACK modules feature a rugged ceramic substrate that electrically insulates the module internals from the heatsink, so no additional isolation is required. Typically, system designers will maximize thermal conductivity of the thermal interface material to reduce the MOSFET junction temperature, provide more thermal margin, and increase system lifetime. If you would like to avoid applying thermal grease during system assembly, WolfPACK modules may be ordered with a pre-applied, phase-change thermal interface material. For further details on mounting multiple modules, please reference the Wolfpack Mounting Instructions and PCB Requirements guide, page 18. 

Best, 

Calvin 

TBhatia

Hi, I hope that this answered your question. I will close this discussion for now but if you have a follow up question, please "Start a New Discussion" and we would be glad to support you further.