Aluminum Nitride Thermal Interface Material
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Hi,
For the Aluminum Nitride thermal interface material 32mmx32mmx1mm, how much pressure is supposed to be applied to the AlN sheet? Is there a pressed ratio (like 1mm thickness should be pressed to 0.9mm)? This material is stiff and brittle, maybe there shouldn't be much pressure applied to it and it's not supposed to be pressed down and shrink?
Thanks.
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Hello,
AlN TIM material does not need a pressure applied to it specifically to enable it's thermal properties (such as other TIMs like Sil-Pads require). The only pressure that it needed is the mounting pressure used to attach the discrete package itself by screw, clip, or any other mounting configuration used into the system. This will help limit the contact resistance between the package and AlN (recommend to use thermal grease as well). Any additional pressure will risk damaging the AlN as it is a very brittle material and could lead to cracking and loss of electrical isolation while not providing any additional thermal benefits
Thanks
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