SpeedFit™ Design Simulator
Simulate and evaluate the performance of SiC-based power circuits and determine the right SiC device in seconds.
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Hi, We GH Induction India pvt ltd located in Chennai. A joint venture of GH Spain. We are the OEM manufacturing induction heating machines. We use CAB011M12FM3 and CAB006M12GM3T in our PCB. To assemble the Sic module device we need fixture of top and bottom mould. Also
required stencil to apply heat shink paste. Kindly share us the CAD drawing for the same. Thank you
Comments
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Thank you for your post, it has been approved and we will respond as soon as possible.
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Dear Sir,
Thank you for your response. Kindly send us the required model in 2D and 3D drawings. we have to manufacture the pressing tool and heat sink applying stencil before starting the PCB and device fixing. Thank you for the support. kindly send us your mail id so that we can send the mail.
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ghindia,
The requested files have been sent to the email linked to your forum account. Please let us know if you have further questions. Thanks!
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Hi,
Yes, we have received the drawings from Calvin Flack. Thank you for the support.
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