Rather than mounting a module such as the CBB011M12GM4T on a "cold plate" would it be possible to mount this module on a liquid-cooling device similar to the "Shower power" system promoted by Danfoss Power Semiconductors? The advantage of this approach is that it eliminates the critical thermal juncture between the module baseplate and yet another metallic surface (requiring TMI or similar materials as interface), both with a non-negligible Rth, by having the cooling liquid in direct contact with the module baseplate itself.